Ready for high speed: tde at ANGA COM 2024
For the first time at ANGA COM, tde – trans data elektronik GmbH, internationally successful developer and manufacturer of scalable cabling systems and technology leader in multi-fibre technology, will be exhibiting the company’s portfolio for investment- and future-proof cabling systems. The focus is on solutions that meet the constantly growing demand for more and more bandwidth. One highlight is the innovative tML Reverse Module, which allows the same port density both in the rear area and in the patch area. Visitors to the booth can also experience the innovative plug-and-play cabling system tML 24+ with the compact MMC connector from US Conec and the modular Central Office solution tDF. ANGA COM will take place from 14 to 16 May in Cologne. tde invites visitors to be a guest at the tde booth. For mutual planning security, tde also allocates fixed appointments to interested trade fair visitors on request. More information can be found on the tde.de website.
